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Indian space agency reports that all systems are go on its historic Chandrayaan lunar mission
- August 27, 2023
- Posted by: Dordea Paul
- Categories: Innovation, International
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TSMC, Bosch, Infineon, and NXP establish joint venture for semiconductor manufacturing
- August 14, 2023
- Posted by: Dordea Paul
- Categories: Innovation, International
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Renesas’ Sequans buy signals MCU clout in cellular IoT
- August 8, 2023
- Posted by: Dordea Paul
- Categories: International, iot
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How to Minimize the Risk of Counterfeit Components
- July 31, 2023
- Posted by: Dordea Paul
- Category: International
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Google report highlights AI’s impact on the UK economy
- July 17, 2023
- Posted by: Dordea Paul
- Categories: Innovation, International, IT
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Dacia va participa din 2025 la raliul Dakar
- July 10, 2023
- Posted by: Dordea Paul
- Categories: Innovation, International, IT
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New microcomb device advances photonic technology
- June 26, 2023
- Posted by: Dordea Paul
- Categories: Innovation, International, IT
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GESS ofera premii la concursul Hardware & Software Engineering organizat de Facultatea de Inginerie “Hermann Oberth” Sibiu
- June 3, 2023
- Posted by: Dordea Paul
- Category: Uncategorized
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Introducing Pixel Fold: Google’s first foldable phone
- May 14, 2023
- Posted by: Dordea Paul
- Categories: Innovation, International, IT
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Poftiți la cafea și la joburi!
- April 28, 2023
- Posted by: Dordea Paul
- Category: Uncategorized
